SEI PaperOne Laser Cutting System
Take the Die Out of Die Cutting
Efficient, Accurate and Modular
Your competitors will wonder how you do it. You’ll be grinning all the way to the bank. Laser cutting with SEI’s PaperOne efficiently & consistently cuts complex patterns in paper, cardboard, adhesive-coated, PP, BOPP and PET stocks. Die-cut, micro perforate, pierce & engrave one or a batch of packages, greetings, literature, envelopes & more with pinpoint accuracy. For inline operation, integrate the modular PaperOne with the HP Indigo 10000, 30000 and virtually any digital press.