At PACK Expo Las Vegas 2019 the Matik booth featured, among other things, the SEI Laser PackMaster WD. Matik is the exclusive North American distributor of SEI equipment. This laser system is designed for laser cutting, laser scoring, or macro- or micro-perforation of single- or multi-layer flexible films. Compatible materials include PE, PET, PP, nylon, and PTFE. The main laser advantages and features include the precise selective material removal, the laser perforating capability (hole size from 100 micron), and repeatability of the process. The all-digital process allows a rapid change-over and a significant time and cost reduction, which is not possible in the case of “analog” mechanical die-boards, says Matik.
One good example of a packaging benefiting from this technology is the stand-up pouch for Rana Duetto ravioli shown here (4). The colorful printed material is sent through the PackMaster laser cutting system and then a clear film is laminated to the printed material. PW
Learn more about the SEI Laser