Labelexpo Americas 2022
September 13 – 15, 2022 | Chicago
Supply chain delays and uncertainties are increasing lead times and costs for companies relying on traditional die cutting. The Labelmaster from SEI Laser uses state-of-the-art software and laser technology to cut, engrave, mark and etch narrow web applications, digitally.
Visit SEI Laser, KELVA, MELZER and Matik at booth #5901 in exhibit hall F.
Stop losing profits to reduced output and increased waste from job changeovers and die tooling.
Benefits of the Labelmaster digital workflow:
- Reduce downtime with less setup and instant job changes
- Create new designs only lasers can produce
- Reduce overhead with no die tooling costs
- Shorter runs can be profitable with less waste and labor costs
See the Labelmaster in action at Labelexpo Americas, September 13 – 15 at booth 5901. Explore game-changing laser cutting, engraving, marking and dot etching systems from SEI Laser, web cleaning systems from KELVA and RFID solutions from MELZER.
Our experts can help you accelerate new business opportunities and gain a competitive edge with new and efficient technology.
Bring Your Own File for Finishing at Labelexpo
See how the Labelmaster goes from vector file to finished product with your own file. Bring a vector die line on a USB drive, up to 13″ wide, to our booth and we’ll run your job through Labelmaster’s digital workflow. See how fast it can cut, kiss-cut and micro-perforate.