SEI Laser PaperOne 5000

SEI Laser PaperOne 5000 SEI Laser PaperOne 5000 is the most innovative CO2 LASER system for laser die-cutting, microperforating, piercing, engraving, bleaching and marking paper sheets, cardboard and adhesive-coated paper. It is also compatible with PP, BOPP and PET. PaperOne simplifies and unifies different processes. It is the most flexible and fastest machine for complex Read more…

SEI Laser PackMaster CW

SEI Laser PackMaster CW is a line of laser systems designed for laser cutting, laser scoring, macro- and micro-perforation of single- or multi-layer flexible films. Compatible materials include PE, PET, PP, nylon, PTFE. The main laser advantages and features include the precise selective material removal, the laser perforating capability (hole size from 100 micron) and repeatability of the process. Provides speeds Read more…

Edale FDC510

       Web-Fed Flatbed Die Cutting The FDC-510 is an ideal solution for converting conventional or digitally printed products which require cutting, creasing and braille embossing, combining the best of sheet-fed flatbed die-cutting technology with a cutting-edge servo-driven, constant-tension web transport system. FDC-510 has a maximum speed of 10,000 impressions per hour, the ability to Read more…

SEI Laser PaperOne 3500

SEI Laser PaperOne PaperOne is the most innovative CO2 LASER system for laser die-cutting, microperforating, piercing, engraving, bleaching and marking paper sheets, cardboard and adhesive-coated paper. It is also compatible with PP, BOPP and PET. PaperOne simplifies and unifies different processes. It is the most flexible and fastest machine for complex die-cutting for micro-packaging and Read more…

SEI Laser PackMaster WD

SEI Laser PackMaster WD is a line of laser systems designed for laser cutting, laser scoring, macro- and micro-perforation of single- or multi-layer flexible films. Compatible materials include PE, PET, PP, nylon, PTFE. The main laser advantages and features include the precise selective material removal, the laser perforating capability (hole size from 100 micron) and repeatability of the process. Provides speeds Read more…

SEI Laser LabelMaster

SEI Label Master is the state of the art system for processing roll materials in the packaging and labeling fields.