SEI Laser PaperOne 5000

SEI Laser PaperOne 5000 SEI Laser PaperOne 5000 is the most innovative CO2 LASER system for laser die-cutting, microperforating, piercing, engraving, bleaching and marking paper sheets, cardboard and adhesive-coated paper. It is also compatible with PP, BOPP and PET. PaperOne simplifies and unifies different processes. It is the most flexible and fastest machine for complex Read more…

SEI Laser PackMaster CW

SEI Laser PackMaster CW is a line of laser systems designed for laser cutting, laser scoring, macro- and micro-perforation of single- or multi-layer flexible films. Compatible materials include PE, PET, PP, nylon, PTFE. The main laser advantages and features include the precise selective material removal, the laser perforating capability (hole size from 100 micron) and repeatability of the process. Provides speeds Read more…

SEI Laser PaperOne 3500

SEI Laser PaperOne PaperOne is the most innovative CO2 LASER system for laser die-cutting, microperforating, piercing, engraving, bleaching and marking paper sheets, cardboard and adhesive-coated paper. It is also compatible with PP, BOPP and PET. PaperOne simplifies and unifies different processes. It is the most flexible and fastest machine for complex die-cutting for micro-packaging and Read more…

SEI Laser PackMaster WD

SEI Laser PackMaster WD is a line of laser systems designed for laser cutting, laser scoring, macro- and micro-perforation of single- or multi-layer flexible films. Compatible materials include PE, PET, PP, nylon, PTFE. The main laser advantages and features include the precise selective material removal, the laser perforating capability (hole size from 100 micron) and repeatability of the process. Provides speeds Read more…

SEI Laser LabelMaster

SEI Label Master is the state of the art system for processing roll materials in the packaging and labeling fields.